SMTComponents Comparison : Surface Mounting Type Package Lineup

Surface Mounting Type Package Lineup:

Material	Package Name	Pin Count	Pitches (mm)
Plastic	SOP (Small Out-line L-Leaded Package)	8,16	1.27
		24,28,32,40,44	1.0
	SSOP (Shrink Small Out-line L-Leaded Package)	20	0.95
		30,32,60,64,70	0.8
		60	0.65
	TSOP (1) (Thin Small Out-line L-Leaded Package)	32,40	0.5
	TSOP (2) (Thin Small Out-line L-Leaded Package)	26/20,26/24,28/24,28,32, 44/40,44,48,50/44,50, 54,66,70/64,70,86	1.27
			1.27
			0.8
			0.65
			0.5
	QFP (Quad Flat L-Leaded Package)	44,56,64,80,100,128, 160,208,240,272,304	1.0
		44,56	0.8
		64,80,100	0.65
	High Heat Dissipation QFP	208	0.5
	TQFP(Thin Quad Flat L-Leaded Package)	44, 48, 64, 80, 100, 120	0.8
			0.5
			0.4
	LQFP (Low Profile Quad Flat)	144, 176, 208	0.5
	SOJ(Small Out-line J-Leaded Package)	26/20, 26/24, 28/24, 28, 32, 36, 40, 42, 50	1.27
	QFJ(Quad Flat J-Leaded Package)	18, 20, 22, 28, 32, 44, 68,84	1.27
	BGA/FBGA(Ball Grid Array/Fine Pitch BGA)	48, 84, 104, 144, 176, 224,256, 352, 420, 560	1.27
			1.0
			0.8
	FLGA(Fine Pitch Land Grid Array)	49, 56, 84	0.8
Ceramic	W-CSP(Wafer Level Chip Size Package)	Custom design	0.65
			0.5