Screens and stencils are functionally same. In stencils, instead of
screen mesh, the desired opening is chemically etched out either in metal sheets
or in wire mesh covered with emulsion, such that the stencil opening does not
obstruct solder paste flow. Thus, a stencil provides 100% opening for the paste
to be printed through, whereas the screen provides only about 50% opening.
Stencils can be classified into three major categories.
1. Selectively etched mesh / emulsion screen
The selectively etched mesh /emulsion type is made the same way as the
screen, but the openings are completely etched out. The main disadvantage of
this type of stencil is high cost. Also, because the wire mesh is etched, the
screen is less stable.
All metal mask stencils are not under constant tension and must be
printed on contact only. The opening are generally etched by chemical milling
from both the sides using two positive images. The advantage is long life of the
stencil. The disadvantage is that, because all metal mask stencils allow only
on-contact printing, there is a possibility of solder smear while lifting the
stencil from the work area. Stainless steel or alloy 42 are desirable for SMT
applications. Brass is too soft and therefore likely to deform under higher
printing pressure. When deformed the small interconnects between lands allow
paste to bleed and bridge between lands and they are easily broken. This is
particularly so for FPT components.
2.
Comparison of Screen and Stencil Printing
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